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KMID : 1007519980070030155
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Food Science and Biotechnology
1998 Volume.7 No. 3 p.155 ~ p.159
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Comparison of Wood Adhesive Formulated with Various Components of Soy Flour
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Kim, Kang Sung
Park, Sang Kyu/Jang, Eun Gyung/Park, Young Ho/Lee, Seoung Yong/Hur, Sang Sun/Kang, Sung Tae
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Abstract
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Wood adhesive formulated with soy flour was tested for the effects of pressing conditions on break load when maple hard wood was used as the adherend and a compressive method using Instron Universial Testing Machine. The soy flour adhesive exhibited a break load 73 ㎏ at pressing conditions of 3 ㎏/㎠, 92℃ and 5 min. For bonding 8 ㎠ area of maple wood surfaces, a minimum 100 ㎎ of the adhesive had to be applied. Protein was mainly responsible for the adhesive, while cell wall material, the major constituent of soy flour, had little or no influence. Adhesive formulated with purified 7S protein showed a higher break load (74.8 ㎏) compared to formulations with soy flour or 11S protein (72.6 ㎏). The stability of bonded joins were conditions. At the dry condition of 65% relative humidity (RH), the break load of bonded sample remained stable at 50℃, as well as at 30℃, up to 80 day of storage. However, at the humid condition (RH 100%), a rapid deterioration occured even during storage at 30℃. Alginate, as added carbohydrate, improved the performance of the glue by approximately 8%, although the water resistance of the glue was not affected.
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